| Contents: |
| Overall View of Failure Analysis of Microelectronic Devices , Test-and-Fail Verification , Decapsulation and Package Analysis , Electrical Techniques, Electron/Ion-Beam Based Techniques, Thermal Techniques , Photonic Techniques , Software Techniques , Deprocessing and Sample Preparation , Physical/Chemical Defect Characterization , Discrete/Passive Component Analysis, Failure Modes and Mechanisms ,Advance Techniques , Laboratory Operations and Management |
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| Microelectronic Failure Analysis Desk Reference, 4th Edition |
| edited by Technical Editors: Richard J. Ross and Christian Boit Executive Editor: Donald Staab, 700pp, 1999, ISBN: 0871706385 |
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This updated reference book, prepared by experts in their fields, contains 60 articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most frequently needed information on this subject at your fingertips. |
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| Developments over the past six years have been covered in this expanded text, while previously covered topics have been revisited with a fresh perspective. New material includes fault isolation and characterization, as well as state-of-the-art techniques to analyze the die from the backside. |
| $199.00 |
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