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Contents: |
| Overall View of Failure Analysis of Microelectronic Devices , Test-and-Fail Verification , Decapsulation and Package Analysis , Electrical Techniques, Electron/Ion-Beam Based Techniques, Thermal Techniques , Photonic Techniques , Software Techniques , Deprocessing and Sample Preparation , Physical/Chemical Defect Characterization , Discrete/Passive Component Analysis, Failure Modes and Mechanisms ,Advance Techniques , Laboratory Operations and Management |
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| Microelectronic Failure Analysis Desk Reference, 4th Edition |
| edited by Technical Editors: Richard J. Ross and Christian Boit Executive Editor: Donald Staab, 700pp, 1999, ISBN: 0871706385 |
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This updated reference book, prepared by experts in
their fields, contains 60 articles covering a wide
range of topics involving the failure analysis of
microelectronics.
It places
the most frequently needed information on this subject
at your fingertips.
Developments
over the past six years have been covered in this
expanded text, while previously covered topics have
been revisited with a fresh perspective. |
|
| New material
includes fault isolation and characterization, as well as
state-of-the-art techniques to analyze the die from the
backside. |
| $199.00 |
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Please note: Prices and availability
are subject to change |