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| Electronic Packaging |
| Click on any title below for a brief description. |
| Air Cooling Technology for Electronic Equipment - Edited by Sung Jin Kim and Sang Woo Lee |
| Electronic Packaging Materials and Their Properties - Michael Pecht, Rakesh Agarwal, Patrick McClusky, Terrance J. Dishongh, Sirus Javadpour, and Rahul Mahajan |
| Guidebook for Managing Silicon Chip Reliability - Michael G. Pecht, Riko Radjojcic, Gopal Rao |
| High Temperature Electronics - Edited by F. Patrick McCluskey, Richard Grzybowski, and Thomas Podlesak |
| Influence of Temperature on Microelectronics and System Reliability - Edited by Pradeep Lall, Michael Pecht, and Edward Hakim |
| Thermal Measurements in Electronics Cooling - Kaveh Azar |
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