Electronic Packaging
Click on any title below for a brief description.
Air Cooling Technology for Electronic Equipment - Edited by Sung Jin Kim and Sang Woo Lee
Electronic Packaging Materials and Their Properties - Michael Pecht, Rakesh Agarwal, Patrick McClusky, Terrance J. Dishongh, Sirus Javadpour, and Rahul Mahajan
Guidebook for Managing Silicon Chip Reliability - Michael G. Pecht, Riko Radjojcic, Gopal Rao
High Temperature Electronics - Edited by F. Patrick McCluskey, Richard Grzybowski, and Thomas Podlesak
Influence of Temperature on Microelectronics and System Reliability - Edited by Pradeep Lall, Michael Pecht, and Edward Hakim
Thermal Measurements in Electronics Cooling - Kaveh Azar

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