| Contents: |
- Ch. 1. Overview of High Temperature Electronics
- Ch. 2. Selection and Use of Silicon Device at High Temperatures
- Ch. 3. Wide Band gap Semiconductors
- Ch. 4. Passive Device Selection and Use at High Temperature
- Ch. 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures
- Ch. 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures
- Ch. 7. Thermal Management for High Temperature Electronics
- Ch. 8. Applications
- Ch. 9. Accelerated Testing of Elevated Temperature Electronics
- References
Index
|
|
| High Temperature Electronics |
| Edited by F. PatrickMcCluskey, Richard Grzybowski, and Thomas Podlesak, 352pp., 1997, ISBN:0849396239 |
|
|
Packaging and device engineers and technologists will find High TemperatureElectronics required reading for its coverage of the techniquesand tradeoffs involved in materials selection, design, and thermal managementand for its presentation of best design practices using actual fieldedsystems as examples. Topics range from semiconductor device selection totesting and final assembly. |
|
| $177.00 |
|
|
|
|
|