| Contents: |
- 1. Introduction
- 2. How Devices Fail
- 3. Intrinsic Device Sensitivities
- 4. Electromigration
- 5. Hot Carrier Aging
- 6. Time-Dependent DielectricBreakdown
- 7. Mechanical Stress-InducedMigration
- 8. Alpha Particle Sensitivity
- 9. Electrostatic Discharge andElectrical Overstress
- 10. Latchup
- 11. Design for Reliability
- 12. Process Development
- 13. Manufacturing
- 14. Qualification
- 15. Screening
- Summary
- References
Index
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| Guidebook forManaging Silicon Chip Reliability |
| by Michael G. Pecht,Riko Radjojcic, Gopal Rao, 224 pp., 1998, ISBN: 0849396247 |
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Achieving cost-effective performance over time requires an organized, disciplined,and time-phased approach to product design, development, qualification,manufacture, and in-service management.Guidebook for Managing SiliconChip Reliability examines the principal failure mechanisms associatedwith modern integrated circuits and describes common practices used toresolve them. |
Thisquick reference on semiconductor reliability addresses the key question:How will the understanding of failure mechanisms affect the future?
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| Chapters discuss: |
- failure sites, operational loads,and failure mechanism
- intrinsic device sensitivities
- electromigration
- hot carrier aging
- time dependent dielectric breakdown
- mechanical stress induced migration
- alpha particle sensitivity
- electrostatic discharge (ESD)and electrical overstress
- latch-up
- qualification
- screening
- guidelines for designing reliability
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| Features: |
- Includes an extensive tabledetailing the types of mechanism failures, such as self-heating and hotcarrier aging
- Examines deep sub-micron challenges,such as power dissipation, switching noise, and cross talk
- Outlines how to establish thespecifications defining chip performance, cost, quality, and reliability
- Concentrates on device failureand causes throughout the text - showing how to model the mechanism, testfor defects, and avoid and manage damage
- Presents information on evolvingIC technologies and future practices
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| Guidebook for Managing Silicon Chip Reliability focuses on devicefailure and causes throughout providing a thorough framework on how tomodel the mechanism, test for defects, and avoid and manage damage. Itwill serve as an exceptional resource for electrical engineers as wellas mechanical engineers working in the field of electronic packaging. |
| $69.95 |
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