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Contents: |
- 1. Introduction
- 2. How Devices Fail
- 3. Intrinsic Device Sensitivities
- 4. Electromigration
- 5. Hot Carrier Aging
- 6. Time-Dependent Dielectric Breakdown
- 7. Mechanical Stress-Induced Migration
- 8. Alpha Particle Sensitivity
- 9. Electrostatic Discharge and Electrical Overstress
- 10. Latchup
- 11. Design for Reliability
- 12. Process Development
- 13. Manufacturing
- 14. Qualification
- 15. Screening
- Summary
- References
Index
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| Guidebook for Managing Silicon Chip Reliability |
| by Michael G. Pecht,Riko Radjojcic, Gopal Rao, 224 pp., 1998, ISBN: 0849396247 |
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Guidebook for Managing Silicon Chip Reliability - $69.95 each
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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management.
Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
This quick reference on semiconductor reliability addresses the key question:
How will the understanding of failure mechanisms affect the future? |
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| Chapters discuss: |
- failure sites, operational loads, and failure mechanism
- intrinsic device sensitivities
- electromigration
- hot carrier aging
- time dependent dielectric breakdown
- mechanical stress induced migration
- alpha particle sensitivity
- electrostatic discharge (ESD) and electrical overstress
- latch-up
- qualification
- screening
- guidelines for designing reliability
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| Features: |
- Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging
- Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk
- Outlines how to establish the specifications defining chip performance, cost, quality, and reliability
- Concentrates on device failure and causes throughout the text - showing how to model the mechanism, test for defects, and avoid and manage damage
- Presents information on evolving IC technologies and future practices
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| Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging. |
| $69.95 |
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Please note: Prices and availability
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