| Contents: |
| Introduction |
| Properties of ElectronicsPackaging Materials |
| Electrical Properties |
| Thermal and ThermomechanicalProperties |
| Mechanical Properties |
| Chemical Properties |
| Miscellaneous Properties |
| Zeroth-Level Packaging Materials |
| Semiconductors |
| Attachment Materials |
| Substrates |
| First-Level Packaging Materials |
| Wire Interconnects |
| Tape Interconnects |
| Case Materials |
| Lid Seals |
| Leads |
| Second-Level Packaging Materials |
| Reinforcement Fiber Materials |
| Resigns |
| Laminates |
| Constraining Cores |
| Flexible Wiring Board Materials |
| Conductor Metals in Laminates |
| Conformal Coatings |
| Third-Level Packaging Materials |
| Backpanel Materials |
| Connectors Materials |
| Cables and Flex CircuitMaterials |
| Summary |
| Appendices |
| Index |
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| Electronic PackagingMaterials and Their Properties |
| by Michael Pecht, RakeshAgarwal, Patrick McClusky, Terrance J. Dishongh, Sirus Javadpour, and RahulMahajan, 128pp., 1999, ISBN: 0849396255 |
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Packaging materials strongly affect the effectiveness of an electronicpackaging system regarding reliability, design, and cost. In electronicsystems, packaging materials may serve as electrical conductors or insulators,create structure and form, provide thermal paths, and protect the circuitsfrom environmental facts, such as moisture, contamination, hostile chemicals,and radiation. |
Electronic Packaging Materials and Their Properties examines thearray of packaging architecture, outlining the classification of materialsand their use for various tasks requiring performance over time.
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| Applications discussedinclude: |
- interconnections
- printed circuit boards
- substrates
- encapsulants
- dielectrics
- die attach materials
- electrical contacts
- thermal materials
- solders
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| Electronic Packaging Materials and Their Properties alsoreviews key electrical, thermal, thermomechanical, mechanical, chemical,and miscellaneous properties as well as their significance in electronicpackaging. |
| Features: |
- Discusses the use of materialsand reliability issues related to them and their interfaces
- Reviews critical electrical,thermal, mechanical, and chemical properties
- Analyzes electronic packagingarchitectures - ranging from zeroth to third levels
- Demonstrates how the levelsof packaging or packaging architectures classify materials and their performance
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| $69.95 |
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