| Contents: |
- Ch. 1. Geometric Optimizationof Cooling Techniques
- By Adrian Bejan
- Ch. 2. Entrance Design Correlationsfor Circuit Boards in Forced-Air Cooling
- By M. Faghri, M. Molki, Y.Asako
- Ch. 3. Forced Air Cooling ofLow-Profile Package Arrays
- By R. A. Wirtz
- Ch. 4. Conjugate Heat Transferin Forced Air Cooling of Electronic Components
- By Alfonso Ortega
- Ch. 5. Enhanced Air Coolingof Electronic Equipment
- By Suresh V. Garimella
- Ch. 6. Limits of Air Cooling- A Methodical Approach
- By Kaveh Azar
Index
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| Air Cooling Technologyfor Electronic Equipment |
| Edited by Sung Jin Kimand Sang Woo Lee, 272pp., 1996, ISBN: 0849394473 |
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What is the optimal spacing between the printed circuit boards? What isa good estimate of the heat transfer coefficient and the associate pressuredrop for forced convention over package arrays? How are heat transfer andfluid flow characteristics in the entrance region different from thosein the fully developed region? What is the effect of substrate conductionon convection cooling? Air Cooling Technology for Electronic Equipmentanswers questions frequently asked by thermal and packaging engineers challengedby the current demand for increased thermal control in electronics. |
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| $94.95 |
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