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Contents: |
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Ch. 1. Geometric Optimizationof Cooling Techniques
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By Adrian Bejan
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Ch. 2. Entrance Design Correlationsfor Circuit Boards in Forced-Air Cooling
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By M. Faghri, M. Molki, Y.Asako
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Ch. 3. Forced Air Cooling ofLow-Profile Package Arrays
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By R. A. Wirtz
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Ch. 4. Conjugate Heat Transferin Forced Air Cooling of Electronic Components
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By Alfonso Ortega
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Ch. 5. Enhanced Air Coolingof Electronic Equipment
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By Suresh V. Garimella
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Ch. 6. Limits of Air Cooling- A Methodical Approach
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By Kaveh Azar
Index
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Air Cooling Technology for Electronic Equipment |
| Edited by Sung Jin Kim and Sang Woo Lee, 272pp., 1996, ISBN: 0849394473 |
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What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convention over package arrays?
How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region?
What is the effect of substrate conduction on convection cooling?
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Air Cooling Technology for Electronic Equipment answers questions frequently asked by thermal and packaging engineers challenged by the current demand for increased thermal control in electronics. |
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$94.95 |
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