Contents:
Ch. 1. Geometric Optimizationof Cooling Techniques 
By Adrian Bejan
Ch. 2. Entrance Design Correlationsfor Circuit Boards in Forced-Air Cooling 
By M. Faghri, M. Molki, Y.Asako
Ch. 3. Forced Air Cooling ofLow-Profile Package Arrays 
By R. A. Wirtz
Ch. 4. Conjugate Heat Transferin Forced Air Cooling of Electronic Components 
By Alfonso Ortega
Ch. 5. Enhanced Air Coolingof Electronic Equipment 
By Suresh V. Garimella
Ch. 6. Limits of Air Cooling- A Methodical Approach 
By Kaveh Azar

Index 
Air Cooling Technologyfor Electronic Equipment
Edited by Sung Jin Kimand Sang Woo Lee, 272pp., 1996, ISBN: 0849394473
    What is the optimal spacing between the printed circuit boards? What isa good estimate of the heat transfer coefficient and the associate pressuredrop for forced convention over package arrays? How are heat transfer andfluid flow characteristics in the entrance region different from thosein the fully developed region? What is the effect of substrate conductionon convection cooling? Air Cooling Technology for Electronic Equipmentanswers questions frequently asked by thermal and packaging engineers challengedby the current demand for increased thermal control in electronics.
 
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